Heat shrink films and articles encapsulated therein
A Standard patent application filed on 22 December 2005 credited to Blackwell, Christopher J.
;
Kaul, Payal
;
Henderson, Kevin O.
Details
Application number :
2005322092
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Heat shrink films and articles encapsulated therein
Inventor :
Blackwell, Christopher J.
;
Kaul, Payal
;
Henderson, Kevin O.
Agent name :
Callinans
Address for service :
1193 Toorak Road Camberwell VIC 3124 Australia
Filing date :
22 December 2005
Associated companies :
Applicant name :
Avery Dennison Corporation
Applicant address :
150 North Orange Grove Boulevard Pasadena CA 91103 United States of America