Method of contact coating a microneedle array
A Standard patent application filed on 18 November 2005 credited to Knutson, Gordon P.
;
David, Moses M.
;
Choi, Hye-Ok
Details
Application number :
2005306372
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Method of contact coating a microneedle array
Inventor :
Knutson, Gordon P.
;
David, Moses M.
;
Choi, Hye-Ok
Agent name :
Davies Collison Cave
Address for service :
Level 14 255 Elizabeth Street Sydney NSW 2000 Australia
Filing date :
18 November 2005
Associated companies :
Applicant name :
3M Innovative Properties Company
Applicant address :
3M Center Post Office Box 33427 Saint Paul MN 55133-3427 United States of America