An iodine-containing hot melt pressure sensitive adhesive capable of being melted and coated at a temperature not higher than 100 degree C, and a medical adhesive sheet product with such a pressure sensitive adhesive
A Standard patent application filed on 06 May 2005 credited to Takaki, Shunsuke
Details
Application number :
2005244798
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
An iodine-containing hot melt pressure sensitive adhesive capable of being melted and coated at a temperature not higher than 100 degree C, and a medical adhesive sheet product with such a pressure sensitive adhesive
Inventor :
Takaki, Shunsuke
Agent name :
Davies Collison Cave
Address for service :
Level 14 255 Elizabeth Street Sydney NSW 2000 Australia
Filing date :
06 May 2005
Associated companies :
Applicant name :
3M Innovative Properties Company
Applicant address :
3M Center Post Office Box 33427 Saint Paul MN 55133-3427 United States of America