Polymer powder containing polyamide, use of said powder in a moulding method and moulded body produced from the same
A Standard patent application filed on 21 March 2005 credited to Baumann, Franz-Erich ; Monsheimer, Sylvia ; Grebe, Maik

Details

Application number :
2005243498  
Application type :
Standard  
Application status :
SEALED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Polymer powder containing polyamide, use of said powder in a moulding method and moulded body produced from the same  
Inventor :
Baumann, Franz-Erich ; Monsheimer, Sylvia ; Grebe, Maik  
Agent name :
Spruson & Ferguson  
Address for service :
Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia  
Filing date :
21 March 2005  
Associated companies :
 
Applicant name :
Evonik Degussa GmbH  
Applicant address :
Rellinghauser Strasse 1-11 45128 Essen Germany  
Old name :
Degussa AG  
Original Source :
Go  

Same Inventor