Mechanism for the deployment of endovascular implants

Application number :: 2005212161
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Mechanism for the deployment of endovascular implants
Inventor :: Cox, Brian ; Fitz, Matthew ; Schaefer, Dean ; Lei, Cathy Lok
Agent name :: Spruson & Ferguson
Address for service :: Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia
Filing date :: 21 January 2005
Associated companies :
Applicant name :: Microvention, Inc.
Applicant address :: 75 Columbia Suite A Aliso Viejo California 92656 United States of America
Old name :
Original Source :: Go

Mechanism for the deployment of endovascular implants A Standard patent application filed on 21 January 2005 credited to Cox, Brian ; Fitz, Matthew ; Schaefer, Dean ; Lei, Cathy Lok