Method and system for packaging a MEMS device
A Standard patent application filed on 28 July 2005 credited to Gally, Brian James
;
Tung, Ming-Hau
;
Miles, Mark W
;
Sampsell, Jeffrey B
Details
Application number :
2005203319
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method and system for packaging a MEMS device
Inventor :
Gally, Brian James
;
Tung, Ming-Hau
;
Miles, Mark W
;
Sampsell, Jeffrey B
Agent name :
Madderns Patent & Trade Mark Attorneys
Address for service :
GPO Box 2752 Adelaide SA 5001 Australia
Filing date :
28 July 2005
Associated companies :
Applicant name :
IDC, LLC
Applicant address :
2415 Third Street San Francisco California 94107 United States of America