Method and apparatus for applying particulate material to a substrate
A Standard patent application filed on 22 March 2005 credited to Fung, Paul Y.
;
Tremblay, Denis
Details
Application number :
2005201228
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Method and apparatus for applying particulate material to a substrate
Inventor :
Fung, Paul Y.
;
Tremblay, Denis
Agent name :
Shelston IP
Address for service :
Level 21 60 Margaret Street Sydney NSW 2000 Australia
Filing date :
22 March 2005
Associated companies :
Applicant name :
McNeil-PPC, Inc.
Applicant address :
Grandview Road Skillman NJ 08558 United States of America