Polyimide resin with reduced mold deposit
A Standard patent application filed on 10 June 2004 credited to Sanner, Mark Alan
;
Kernick, William A. Iii
;
Oldle, Roy Ray
;
Gallucci, Robert Russell
Details
Application number :
2004249690
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Polyimide resin with reduced mold deposit
Inventor :
Sanner, Mark Alan
;
Kernick, William A. Iii
;
Oldle, Roy Ray
;
Gallucci, Robert Russell