Meso-microelectromechanical system package
A Standard patent application filed on 18 December 2003 credited to Lian, Ke ; Klosowiak, Tomasz ; Lempkowski, Robert ; Eliacin, Manes

Details

Application number :

2003304052  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Meso-microelectromechanical system package  

Inventor :

Lian, Ke ; Klosowiak, Tomasz ; Lempkowski, Robert ; Eliacin, Manes  

Agent name :

 

Address for service :

 

Filing date :

18 December 2003  

Associated companies :

 

Applicant name :

MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE  

Applicant address :

1303 East Algonquin Road, Schaumburg, IL 60196  

Old name :

 

Original Source :

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