Hot runner manifold system
A Standard patent application filed on 04 February 2003 credited to Bouti, Abdeslam
;
Serniuck, Nicholas
;
Knapp, John
;
Jenko, Edward J.
Details
Application number :
2003303887
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Hot runner manifold system
Inventor :
Bouti, Abdeslam
;
Serniuck, Nicholas
;
Knapp, John
;
Jenko, Edward J.
Agent name :
Spruson & Ferguson
Address for service :
Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia
Filing date :
04 February 2003
Associated companies :
Applicant name :
Husky Injection Molding Systems Ltd.
Applicant address :
AMC/IP Group 500 Queen Street South Bolton Ontario L7E 5S5 Canada