Methods of transmitting binding update message and binding acknowledgement message
A Standard patent application filed on 05 December 2003 credited to Lee, Hak-Goo ; Kim, Sun-Woo ; Kim, Pyung-Soo

Details

Application number :
2003302959  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Methods of transmitting binding update message and binding acknowledgement message  
Inventor :
Lee, Hak-Goo ; Kim, Sun-Woo ; Kim, Pyung-Soo  
Agent name :
 
Address for service :
 
Filing date :
05 December 2003  
Associated companies :
 
Applicant name :
SAMSUNG ELECTRONICS CO., LTD.  
Applicant address :
416, Maetan-dong, Yeongtong-gu, Suwon-si, 442-742 Gyeonggi-do  
Old name :
 
Original Source :
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