Details

Application number :
2003302841  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Lead frame and the same manufacturing method using electroforming  
Inventor :
Kim, Jeong-Sik  
Agent name :
 
Address for service :
 
Filing date :
10 December 2003  
Associated companies :
 
Applicant name :
KIM, Jeong-Sik  
Applicant address :
101-1 Unhak-Dong, Kyounggi-Do, 449-050 Yongin city  
Old name :
 
Original Source :
Go  

Same Inventor