Polishing pad and method for manufacturing semiconductor device
A Standard patent application filed on 27 November 2003 credited to Kazuno, Atsushi ; Ogawa, Kazuyuki ; Shimomura, Tetsuo ; Nakamori, Masahiko ; Yamada, Takatoshi ; Watanabe, Kimihiro

Details

Application number :

2003302299  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing pad and method for manufacturing semiconductor device  

Inventor :

Kazuno, Atsushi ; Ogawa, Kazuyuki ; Shimomura, Tetsuo ; Nakamori, Masahiko ; Yamada, Takatoshi ; Watanabe, Kimihiro  

Agent name :

 

Address for service :

 

Filing date :

27 November 2003  

Associated companies :

 

Applicant name :

TOYO BOSEKI KABUSHIKI KAISHA  

Applicant address :

2-8, Dojima Hama 2-chome, Kita-ku, Osaka-shi, Osaka 530-8230  

Old name :

 

Original Source :

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