High temperature wheel speed sensor package to envelope sensor ic
A Standard patent application filed on 22 December 2003 credited to Taneyhill, David J.

Details

Application number :
2003301207  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
High temperature wheel speed sensor package to envelope sensor ic  
Inventor :
Taneyhill, David J.  
Agent name :
 
Address for service :
 
Filing date :
22 December 2003  
Associated companies :
 
Applicant name :
BENDIX COMMERCIAL VEHICLE SYSTEMS LLC  
Applicant address :
901 Cleveland Street, Elyria, OH 44035  
Old name :
 
Original Source :
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Same Inventor