Structure and method for bonding to copper interconnect structures
A Standard patent application filed on 19 December 2003 credited to Chesire, Daniel Patrick ; Merchant, Sailesh Mansinh ; Bachman, Mark Adam

Details

Application number :

2003300201  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Structure and method for bonding to copper interconnect structures  

Inventor :

Chesire, Daniel Patrick ; Merchant, Sailesh Mansinh ; Bachman, Mark Adam  

Agent name :

 

Address for service :

 

Filing date :

19 December 2003  

Associated companies :

 

Applicant name :

AGERE SYSTEMS INC.  

Applicant address :

1110 American Parkway NE, Allentown, PA 18109  

Old name :

 

Original Source :

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