Passivative chemical mechanical polishing composition for copper film planarization
A Standard patent application filed on 02 December 2003 credited to Bernhard, David ; Liu, Jun ; Wrschka, Peter ; King, Mackenzie ; Darsillo, Michael ; Boggs, Karl

Details

Application number :

2003297590  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Passivative chemical mechanical polishing composition for copper film planarization  

Inventor :

Bernhard, David ; Liu, Jun ; Wrschka, Peter ; King, Mackenzie ; Darsillo, Michael ; Boggs, Karl  

Agent name :

 

Address for service :

 

Filing date :

02 December 2003  

Associated companies :

 

Applicant name :

ADVANCED TECHNOLOGY MATERIALS, INC.  

Applicant address :

William F. Ryann, 7 Commerce Drive, Danbury, CT 06810  

Old name :

 

Original Source :

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