Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
A Standard patent application filed on 25 December 2003 credited to Park, Jea Gun ; Paik, Un Gyu ; Kato, Takeo ; Park, Jin Hyung

Details

Application number :

2003296130  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition  

Inventor :

Park, Jea Gun ; Paik, Un Gyu ; Kato, Takeo ; Park, Jin Hyung  

Agent name :

 

Address for service :

 

Filing date :

25 December 2003  

Associated companies :

 

Applicant name :

SUMITOMO MITSUBISHI SILICON CORPORATION  

Applicant address :

2-1, Shibaura 1-chome, Minato-ku, Tokyo 105-8634  

Old name :

 

Original Source :

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