Spring structural resin molded product, and method and device for forming surface layer on the spring structure resin molded product
A Standard patent application filed on 24 December 2003 credited to Kouno, Iwao
;
Nakamura, Yuichiro
;
Nishibori, Sadao
Details
Application number :
2003296088
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Spring structural resin molded product, and method and device for forming surface layer on the spring structure resin molded product