Single package multi-chip rf power amplifier
A Standard patent application filed on 24 November 2003 credited to Quinn, John Phillip ; Wood, Simon Maurice ; Pengelly, Raymond Sydney

Details

Application number :

2003293028  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Single package multi-chip rf power amplifier  

Inventor :

Quinn, John Phillip ; Wood, Simon Maurice ; Pengelly, Raymond Sydney  

Agent name :

 

Address for service :

 

Filing date :

24 November 2003  

Associated companies :

 

Applicant name :

CREE MICROWAVE, INC.  

Applicant address :

160 Gibraltar Court, Sunnyvale, CA 94089  

Old name :

 

Original Source :

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