Structure to reduce signal cross-talk through semiconductor substrate for system on chip applications
A Standard patent application filed on 14 November 2003 credited to Kyono, Carl
;
Monk, David J.
;
Huang, Wen-Ling M.
;
Welch, Pamela J.
;
Bharatan, Sushil
;
To, Kun-Hin
Details
Application number :
2003291553
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Structure to reduce signal cross-talk through semiconductor substrate for system on chip applications
Inventor :
Kyono, Carl
;
Monk, David J.
;
Huang, Wen-Ling M.
;
Welch, Pamela J.
;
Bharatan, Sushil
;
To, Kun-Hin
Agent name :
Address for service :
Filing date :
14 November 2003
Associated companies :
Applicant name :
FREESCALE SEMICONDUCTOR, INC.
Applicant address :
6501 William Cannon Drive West, Austin, TX 78735, USA