Heat releasable wafer dicing tape
A Standard patent application filed on 17 November 2003 credited to Hariharan, Deepak ; Xia, Wilson Z. ; Barton, Joel

Details

Application number :

2003291550  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Heat releasable wafer dicing tape  

Inventor :

Hariharan, Deepak ; Xia, Wilson Z. ; Barton, Joel  

Agent name :

 

Address for service :

 

Filing date :

17 November 2003  

Associated companies :

 

Applicant name :

ADHESIVES RESEARCH, INC.  

Applicant address :

400 Seaks Run Road, Glen Rock, PA 17327  

Old name :

 

Original Source :

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