Semiconductor device having a bond pad and method for its fabrication
A Standard patent application filed on 12 November 2003 credited to Hess, Kevin
;
Leoni, Michael V.
;
Tran, Tu-Anh
;
Downey, Susan H.
;
Harper, Peter R.
Details
Application number :
2003291472
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Semiconductor device having a bond pad and method for its fabrication
Inventor :
Hess, Kevin
;
Leoni, Michael V.
;
Tran, Tu-Anh
;
Downey, Susan H.
;
Harper, Peter R.
Agent name :
Address for service :
Filing date :
12 November 2003
Associated companies :
Applicant name :
FREESCALE SEMICONDUCTOR, INC.
Applicant address :
6501 William Cannon Drive West, Austin, TX 78735, USA