Integrated and multi-axis sensor assembly and packaging
A Standard patent application filed on 17 March 2000 credited to Rushefsky, Larry
;
Laroo, Richard
;
Goldberg, Howard D.
;
Stalnaker, W. Marc
;
Rinne, Ray
;
Balderes, Demetrios
;
Lemke, Al
;
Ip, Matthew
;
Behn, Lawrence P.
;
Domagalski, Klaus
;
Yu, Lianzhong
;
Details
Application number :
36317
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Integrated and multi-axis sensor assembly and packaging
Inventor :
Rushefsky, Larry
;
Laroo, Richard
;
Goldberg, Howard D.
;
Stalnaker, W. Marc
;
Rinne, Ray
;
Balderes, Demetrios
;
Lemke, Al
;
Ip, Matthew
;
Behn, Lawrence P.
;
Domagalski, Klaus
;
Yu, Lianzhong
;