Package structure and packaging method of semiconductor device
A Standard patent application filed on 15 December 2003 credited to Kobayashi, Kazuo ; Ajika, Natsuo ; Nakashima, Moriyoshi

Details

Application number :

2003289336  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Package structure and packaging method of semiconductor device  

Inventor :

Kobayashi, Kazuo ; Ajika, Natsuo ; Nakashima, Moriyoshi  

Agent name :

 

Address for service :

 

Filing date :

15 December 2003  

Associated companies :

 

Applicant name :

GENUSION INC.  

Applicant address :

The Amagasaki Research Incubation Center, 7-1-3, Doi-cho, Amagasaki-shi, Hyogo 660-0083  

Old name :

 

Original Source :

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