Details

Application number :
2003289275  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same  
Inventor :
Hasegawa, Hideo ; Tachikawa, Hideo ; Mori, Hiroyuki ; Ueda, Hiroyuki ; Miyachi, Yukio ; Ishiko, Masayasu ; Oshima, Tadashi ; Yamada, Yasushi ; Nakanishi, Kazuyuki  
Agent name :
 
Address for service :
 
Filing date :
09 December 2003  
Associated companies :
 
Applicant name :
KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO  
Applicant address :
41-1, Aza Yokomichi, Oaza Nagakute, Ngakute-cho, Aichi-gun, Aichi 480-1192  
Old name :
 
Original Source :
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