Details

Application number :
2003287851  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam  
Inventor :
Kilthau, Alexander ; Van Biesen, Marc ; Mayer, Hans Jurgen  
Agent name :
 
Address for service :
 
Filing date :
27 October 2003  
Associated companies :
 
Applicant name :
SIEMENS AKTIENGESELLSCHAFT  
Applicant address :
Wittelsbacherplatz 2, 80333 Munchen  
Old name :
 
Original Source :
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