Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam
A Standard patent application filed on 27 October 2003 credited to Kilthau, Alexander ; Van Biesen, Marc ; Mayer, Hans Jurgen

Details

Application number :

2003287851  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam  

Inventor :

Kilthau, Alexander ; Van Biesen, Marc ; Mayer, Hans Jurgen  

Agent name :

 

Address for service :

 

Filing date :

27 October 2003  

Associated companies :

 

Applicant name :

SIEMENS AKTIENGESELLSCHAFT  

Applicant address :

Wittelsbacherplatz 2, 80333 Munchen  

Old name :

 

Original Source :

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