Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
A Standard patent application filed on 07 November 2003 credited to Zhang, Haiyan
;
Zazzera, Lawrence A.
;
Lamanna, William M.
;
Boyd, Steven D.
;
Kesari, Susrut
;
Parent, Michael J.
Details
Application number :
2003287545
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
Inventor :
Zhang, Haiyan
;
Zazzera, Lawrence A.
;
Lamanna, William M.
;
Boyd, Steven D.
;
Kesari, Susrut
;
Parent, Michael J.
Agent name :
Address for service :
Filing date :
07 November 2003
Associated companies :
Applicant name :
3M INNOVATIVE PROPERTIES COMPANY
Applicant address :
3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427