Curable pressure sensitive adhesive compositions
A Standard patent application filed on 05 November 2003 credited to Yang, Jie
;
Johnson, Stephen A.
;
Lu, Ying-Yuh
;
Kausch, William L.
;
Mcman, Steven J.
Details
Application number :
2003286902
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Curable pressure sensitive adhesive compositions
Inventor :
Yang, Jie
;
Johnson, Stephen A.
;
Lu, Ying-Yuh
;
Kausch, William L.
;
Mcman, Steven J.
Agent name :
Address for service :
Filing date :
05 November 2003
Associated companies :
Applicant name :
3M INNOVATIVE PROPERTIES COMPANY
Applicant address :
3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427