Solder flux compositions undergoing phase separation during soldering reflow process
A Standard patent application filed on 23 September 2003 credited to Fang, Treliant
;
Wetz, Li Ann
Details
Application number :
2003283969
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Solder flux compositions undergoing phase separation during soldering reflow process
Inventor :
Fang, Treliant
;
Wetz, Li Ann
Agent name :
Address for service :
Filing date :
23 September 2003
Associated companies :
Applicant name :
FREESCALE SEMICONDUCTOR, INC.
Applicant address :
6501 William Cannon Drive West
Austin, TX 78735
United States of America