Integrated circuit package configuration incorporating shielded circuit element
A Standard patent application filed on 15 October 2003 credited to Thomsen, Axel
;
Pietruszynski, David M.
;
Wei, Derrick C.
;
Shi, Ying
;
Zhang, Ligang
;
Proffitt, Steven P.
;
Smith, Kevin G.
Details
Application number :
2003282838
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Integrated circuit package configuration incorporating shielded circuit element
Inventor :
Thomsen, Axel
;
Pietruszynski, David M.
;
Wei, Derrick C.
;
Shi, Ying
;
Zhang, Ligang
;
Proffitt, Steven P.
;
Smith, Kevin G.