Polyoxymethylene resin composition for laser marking
A Standard patent application filed on 18 November 2003 credited to Jeong, Chung-Ryol ; Kim, Tak-Kyu ; Kang, Tae-Gon

Details

Application number :

2003282406  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polyoxymethylene resin composition for laser marking  

Inventor :

Jeong, Chung-Ryol ; Kim, Tak-Kyu ; Kang, Tae-Gon  

Agent name :

 

Address for service :

 

Filing date :

18 November 2003  

Associated companies :

 

Applicant name :

KOREA ENGINEERING PLASTICS CO., LTD.  

Applicant address :

450 Gongduk-2dong, Mapo-gu, 121-805 Seoul  

Old name :

 

Original Source :

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