Non-solder adhesive terminal
A Standard patent application filed on 26 June 2003 credited to Hendrick, John P.
;
Antaya, Stephen C.
;
Machado, Manuel H.
Details
Application number :
2003281741
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Non-solder adhesive terminal
Inventor :
Hendrick, John P.
;
Antaya, Stephen C.
;
Machado, Manuel H.