Thermally crosslinkable materials and multi-layered devices therefrom
A Standard patent application filed on 07 November 2003 credited to Ding, Jianfu ; D'Iorio, Marie ; Li, Yuning ; Tao, Ye ; Day, Michael

Details

Application number :

2003280260  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thermally crosslinkable materials and multi-layered devices therefrom  

Inventor :

Ding, Jianfu ; D'Iorio, Marie ; Li, Yuning ; Tao, Ye ; Day, Michael  

Agent name :

 

Address for service :

 

Filing date :

07 November 2003  

Associated companies :

 

Applicant name :

NATIONAL RESEARCH COUNCIL OF CANADA  

Applicant address :

1200 Montreal Road, Bldg. M-58, Room EG-12, Ottawa, Ontario K1A 0R6  

Old name :

 

Original Source :

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