Printed wiring board and process for producing the same
A Standard patent application filed on 05 November 2003 credited to Tsukada, Yutaka ; Mori, Hiroyuki

Details

Application number :

2003277566  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Printed wiring board and process for producing the same  

Inventor :

Tsukada, Yutaka ; Mori, Hiroyuki  

Agent name :

 

Address for service :

 

Filing date :

05 November 2003  

Associated companies :

 

Applicant name :

INTERNATIONAL BUSINESS MACHINES CORPORATION  

Applicant address :

New Orchard Road, Armonk, NY 10504  

Old name :

 

Original Source :

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