Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
A Standard patent application filed on 30 September 2003 credited to Nickhou, Afshin ; Woods, Carl ; Redeker, Fritz ; Ravkin, Mike ; Boyd, John ; De Larios, John M. ; Garcia, James P.

Details

Application number :

2003277212  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces  

Inventor :

Nickhou, Afshin ; Woods, Carl ; Redeker, Fritz ; Ravkin, Mike ; Boyd, John ; De Larios, John M. ; Garcia, James P.  

Agent name :

 

Address for service :

 

Filing date :

30 September 2003  

Associated companies :

 

Applicant name :

LAM RESEARCH CORPORATION  

Applicant address :

4650 Cushing Parkway, Fremont, CA 94538-6470  

Old name :

 

Original Source :

Go