Details

Application number :
2003277074  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
System and method for performing simultaneous precision die bond of photonic components onto a single substrate  
Inventor :
Capewell, Dale  
Agent name :
 
Address for service :
 
Filing date :
29 September 2003  
Associated companies :
 
Applicant name :
INTEL CORPPORATION  
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052  
Old name :
 
Original Source :
Go  

Same Inventor