System and method for performing simultaneous precision die bond of photonic components onto a single substrate
A Standard patent application filed on 29 September 2003 credited to Capewell, Dale

Details

Application number :

2003277074  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

System and method for performing simultaneous precision die bond of photonic components onto a single substrate  

Inventor :

Capewell, Dale  

Agent name :

 

Address for service :

 

Filing date :

29 September 2003  

Associated companies :

 

Applicant name :

INTEL CORPPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

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