Adhesive composition for dermal patch and production process thereof
A Standard patent application filed on 29 October 2003 credited to Ishii, Tetsuya

Details

Application number :

2003276707  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Adhesive composition for dermal patch and production process thereof  

Inventor :

Ishii, Tetsuya  

Agent name :

 

Address for service :

 

Filing date :

29 October 2003  

Associated companies :

 

Applicant name :

SHOWA DENKO K.K.  

Applicant address :

13-9, Shiba Daimon 1-chome, Minato-ku, Tokyo 105-8518  

Old name :

 

Original Source :

Go  

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