Method for cutting lead terminal of package type electronic component
A Standard patent application filed on 17 October 2003 credited to Kobayakawa, Masahiko

Details

Application number :

2003273038  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for cutting lead terminal of package type electronic component  

Inventor :

Kobayakawa, Masahiko  

Agent name :

 

Address for service :

 

Filing date :

17 October 2003  

Associated companies :

 

Applicant name :

ROHM CO., LTD.  

Applicant address :

21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi, Kyoto 615-8585  

Old name :

 

Original Source :

Go