Sealing material for semiconductor device and method for production thereof
A Standard patent application filed on 09 October 2003 credited to Kamiya, Hiroki ; Okazaki, Masanori ; Kobayashi, Yukio ; Samura, Yoshitaka ; Sumi, Naoko

Details

Application number :

2003272956  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Sealing material for semiconductor device and method for production thereof  

Inventor :

Kamiya, Hiroki ; Okazaki, Masanori ; Kobayashi, Yukio ; Samura, Yoshitaka ; Sumi, Naoko  

Agent name :

 

Address for service :

 

Filing date :

09 October 2003  

Associated companies :

 

Applicant name :

ASAHI GLASS CO., LTD.  

Applicant address :

12-1, Yuraku-cho 1-chome, Chiyoda-ku, , Tokyo 100-8405  

Old name :

 

Original Source :

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