Sealing material
A Standard patent application filed on 03 October 2003 credited to Koga, Atsushi ; Fujimoto, Kenichi ; Nakagawa, Yoshiki ; Ando, Osamu ; Kojima, Yoshifumi ; Kudo, Masashi

Details

Application number :
2003272926  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Sealing material  
Inventor :
Koga, Atsushi ; Fujimoto, Kenichi ; Nakagawa, Yoshiki ; Ando, Osamu ; Kojima, Yoshifumi ; Kudo, Masashi  
Agent name :
 
Address for service :
 
Filing date :
03 October 2003  
Associated companies :
 
Applicant name :
NOK CORPORATION  
Applicant address :
12-15, Shibadaimon 1-chome, Minato-ku, Tokyo 105-8585  
Old name :
 
Original Source :
Go  

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