Details
- Application number :
- 2003271131
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Photosensitive resin composition, and, photosensitive element, method for forming resist pattern and printed wiring board using the composition
- Inventor :
- Hamada, Keishi
;
Kawaguchi, Kennichi
;
Satou, Kuniaki
;
Mamiya, Tsutomu
;
Hama, Masayuki
;
Katsurahara, Tooru
;
Yoshino, Toshizumi
;
Joumen, Masayoshi
- Agent name :
-
- Address for service :
-
- Filing date :
- 08 October 2003
- Associated companies :
-
- Applicant name :
- HITACHI CHEMICAL CO., LTD.
- Applicant address :
- 1-1, Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo 163-0449
- Old name :
-
- Original Source :
- Go