A topical skin-care formuation (tsf) and dipped elastomeric rubber polymer articles produced utilising the tsf
A Standard patent application filed on 13 October 2003 credited to Wong, Ah Kiew ; Lew, Kwong Ann ; Soh, Teck Yee ; Muthu, Letchemy ; Jayaraman, Sarala Devi ; Barclay, Leslie Martin

Details

Application number :

2003269587  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A topical skin-care formuation (tsf) and dipped elastomeric rubber polymer articles produced utilising the tsf  

Inventor :

Wong, Ah Kiew ; Lew, Kwong Ann ; Soh, Teck Yee ; Muthu, Letchemy ; Jayaraman, Sarala Devi ; Barclay, Leslie Martin  

Agent name :

 

Address for service :

 

Filing date :

13 October 2003  

Associated companies :

 

Applicant name :

WRP ASIA PACIFIC SDN. BHD.  

Applicant address :

Lot 1, Jalan 3, Kawasan Perusahaan Bandar Baru Salak Tinggi, 43900 Sepang Selangor  

Old name :

 

Original Source :

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