Details
- Application number :
- 2003266790
- Application type :
- Standard
- Application status :
- SEALED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Jack assembly
- Inventor :
- Sajadi, Ahmad
;
Henneberger, Roy Lee
;
Dewey, James D
- Agent name :
- Phillips Ormonde Fitzpatrick
- Address for service :
- 367 Collins Street Melbourne VIC 3000 Australia
- Filing date :
- 09 December 2003
- Associated companies :
-
- Applicant name :
- ADC Telecommunications, Inc.
- Applicant address :
- 13625 Technology Drive Eden Prairie MN 55344-2252 United States of America
- Old name :
-
- Original Source :
- Go
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