Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure
A Standard patent application filed on 24 September 2003 credited to Kondo, Masuo ; Kikui, Fumiaki

Details

Application number :

2003266588  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure  

Inventor :

Kondo, Masuo ; Kikui, Fumiaki  

Agent name :

 

Address for service :

 

Filing date :

24 September 2003  

Associated companies :

 

Applicant name :

Neomax Materials Co., Ltd.  

Applicant address :

19-1, Minamisuita 2-chome Suita-shi, Osaka 5640043 Japan  

Old name :

 

Original Source :

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