Modular orthopaedic implant apparatus and method
A Standard patent application filed on 02 December 2003 credited to Kennedy, James M.
;
Withee, Phillip G.
;
Lewis, Paul P.
Details
Application number :
2003266434
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Modular orthopaedic implant apparatus and method
Inventor :
Kennedy, James M.
;
Withee, Phillip G.
;
Lewis, Paul P.
Agent name :
Callinans
Address for service :
1193 Toorak Road Camberwell VIC 3124 Australia
Filing date :
02 December 2003
Associated companies :
Applicant name :
DePuy Products, Inc.
Applicant address :
700 Orthopaedic Drive Warsaw Indiana 46581 United States of America