Details
- Application number :
- 2003264537
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Heat-resisting copper alloy materials
- Inventor :
- Oishi, Keiichiro
- Agent name :
-
- Address for service :
-
- Filing date :
- 19 September 2003
- Associated companies :
-
- Applicant name :
- SAMBO COPPER ALLOY CO., LTD.
- Applicant address :
- 8-374, Sambo-cho, Sakai-shi, Osaka 590-0906
- Old name :
-
- Original Source :
- Go