High free shrink, high modulus, low shrink tension film with elastic recovery
A Standard patent application filed on 05 August 2003 credited to Childress, Blaine C.
;
Dayrit, Richard M.
;
Roberts, William P.
;
Lambert, Scott W.
;
Gauthier, William J.
;
Moffitt, Ronald D.
Details
Application number :
2003263983
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
High free shrink, high modulus, low shrink tension film with elastic recovery
Inventor :
Childress, Blaine C.
;
Dayrit, Richard M.
;
Roberts, William P.
;
Lambert, Scott W.
;
Gauthier, William J.
;
Moffitt, Ronald D.
Agent name :
Davies Collison Cave
Address for service :
1 Nicholson Street Melbourne VIC 3000 Australia
Filing date :
05 August 2003
Associated companies :
Applicant name :
Cryovac, Inc.
Applicant address :
Post Office Box 464, 100 Rogers Bridge Rd Duncan SC 29334 United States of America