Camera device, method of manufacturing a camera device, wafer scale package
A Standard patent application filed on 16 September 2003 credited to Sander, Aloysius F. M. ; Van Arendonk, Anton P. M. ; Van Der Sijde, Arjen G. ; De Bruin, Leendert ; Groot, Erik H. ; Dohmen, Gerardus M. ; Wolterink, Edwin M.

Details

Application number :

2003263417  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Camera device, method of manufacturing a camera device, wafer scale package  

Inventor :

Sander, Aloysius F. M. ; Van Arendonk, Anton P. M. ; Van Der Sijde, Arjen G. ; De Bruin, Leendert ; Groot, Erik H. ; Dohmen, Gerardus M. ; Wolterink, Edwin M.  

Agent name :

 

Address for service :

 

Filing date :

16 September 2003  

Associated companies :

 

Applicant name :

KONINKLIJKE PHILIPS ELECTRONICS N.V.  

Applicant address :

Groenewoudseweg 1, NL-5621 BA Eindhoven  

Old name :

 

Original Source :

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