Localized compression molding process for fabricating microstructures on thermoplastic substrates
A Standard patent application filed on 28 August 2003 credited to Donggang, Yao ; Byung, Kim

Details

Application number :
2003262993  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Localized compression molding process for fabricating microstructures on thermoplastic substrates  
Inventor :
Donggang, Yao ; Byung, Kim  
Agent name :
 
Address for service :
 
Filing date :
28 August 2003  
Associated companies :
 
Applicant name :
DONGGANG, Yao  
Applicant address :
522 Tumberlea Drive, Rochester Hills, MI 48309  
Old name :
 
Original Source :
Go  

Same Inventor