A solder interconnection having a layered barrier structure and method for forming same
A Standard patent application filed on 23 April 2003 credited to Chen, William T.
;
Li, Ming
Details
Application number :
2003262555
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
A solder interconnection having a layered barrier structure and method for forming same
Inventor :
Chen, William T.
;
Li, Ming
Agent name :
Address for service :
Filing date :
23 April 2003
Associated companies :
Applicant name :
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Applicant address :
20 Biopolis Way, #07-01
Centros
Singapore 138668
Singapore